B301D/B301B/B301C Aluminum Wire Bonder is a highly stable and precise equipment which can serve as a fast and efficient bonding solution for power transistors (including the automotive electronics and home appliances industries).
Al Wire
4~20mil
Al Ribbon
20*4~80*10 UPH9K
Smart Bonder of China
The wire bonder developed by ATW Coshin filled the gap of high-end bonding system for semiconductor assembly and test in the domestic market
Strong Compatibility
Suitable for Al wire and Al ribbon processes Ideal for products for multiple application scenarios such as TO series, IPM, IGBT, etc.
High Capacity
High capacity TO252-4R leadframe UPH up to 9K/H
Low O&M cost
Self-developed control system enables easy upgrade and maintenance
High-end Intelligence
BPM, GBS, ALC, and other functions facilitate easy operation
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+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
