300mm Wafer final polisher JX300FP
The JX300FP is a leading 12-inch CMP Tool developed based on ATW JX's advanced CMP technology, in response to cutting-edge industry demands. This equipment is equipped with high-performance polishing units and integrates advanced combined cleaning technology, delivering superior cleaning results. It enables nanometer-level global planarization of substrates, meeting the requirements of advanced process technologies.
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No.3 Xinhua Road,
